1. Cleaning: Use ultrasonic to clean PCB or LED bracket and dry.

2. Mounting: After preparing the electrode at the bottom of the LED die (large wafer) with silver glue, expand it, and place the expanded die (large wafer) on the crystal piercing table, and use the crystal pen to remove the die under the microscope. Installed one by one on the corresponding pads of the PCB or LED bracket, and then sintered to cure the silver glue.

　　3, pressure welding: use aluminum wire or gold wire welding machine to connect the electrode to the LED die for the lead of current injection. The LED is directly mounted on the PCB, generally using an aluminum wire welding machine.

　　4. Packaging: The LED die and the bonding wires are protected by epoxy by dispensing glue. Dispensing glue on the PCB has strict requirements on the shape of the glue after curing, which is directly related to the brightness of the finished backlight. This process will also take on the task of phosphor (white light LED).

　　5. Soldering: If the backlight is SMD-LED or other packaged LEDs, the LEDs need to be soldered to the PCB board before the assembly process.

　　6. Film cutting: Die-cutting various diffusion films and reflective films required by the backlight with a punch.

　　7. Assembly: According to the requirements of the drawings, manually install the various materials of the backlight in the correct position.

　　 8. Test: Check whether the photoelectric parameters of the backlight source and the uniformity of the light are good.

　　 9. Packaging: The finished products are packaged and stored as required.